Thermal cycling of a BGA solder joint sub-model
The structural zoom technique (also known as submodelling) can be used to increase the accuracy of #FEA results by increasing ...
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Thermal cycling of a BGA
Ball grid array (#BGA) chips require special attention regarding solder joint reliability and the finite element analysis ...
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Statistical variation of solder meniscus
We updated our parametric solder-joint models for BGAs. We now can include statistical variations of parameters like offset ...
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RMS strain
Flex cracking in MLCCs (Multilayer Ceramic Chip Capacitors) and cracking of solder joints can be caused by dynamic bending ...
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Flex cracking of MLCCs
One of the causes of flex cracking in MLCCs (Multilayer Ceramic Chip Capacitors) is the static bending of a PCB, which in ...
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Coffin Manson equation
With a detailed solder-joint geometry, a visco-plastic material behaviour (Anand or Garofalo), and the Coffin-Manson equation ...
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Garofalo model for visco-plastic behaviour of solder
We implemented the Garofalo model as a viscoplastic material behaviour for solder joints. It can be used in thermo-mechanical ...
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KiCad support
We now support the KiCad board file format (.kicad_pcb) as an import format to build finite element models of PCBs in our ...
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Forced convection Simulation
With our conjugate heat transfer analysis process for PCBAs, we can also simulate forced convection. Thus, we can support ...
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