Statistical variation of solder meniscus

• 01 / 07 / 2023 

We updated our parametric solder-joint models for BGAs. We now can include statistical variations of parameters like offset of pads, solder volume, solder mask thickness, ... . The solder-joint geometry is calculated based on surface tension, gravity and mass of the BGA.

The picture shows 50 cross sections of solder-joint samples including statistical variations. The upper pad is solder mask defined and the lower pad is non-solder mask defined.