Sub-modelling
The structural zoom technique (also known as sub-modelling) can be used to increase the accuracy of #FEA results by increasing ...
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Detailed sub-model of a BGA
The structural zoom technique can also be applied on the results of another submodel, e.g., on the submodel used in our last ...
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riz-up Genius Award 2023
Elastic-Simulations GmbH had been nominated for the riz-up Genius Award in the “digital genial” category and was awarded ...
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Sub-modelling of a BGA chip
The structural zoom technique can also be applied on an entire ball grid array chip to increase the accuracy of #FEA results. ...
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Effect of solder volume
The shape of a solder meniscus depends on the pad dimensions, stencil, surface tension of solder and gravity. The stencil ...
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Thermal cycling of a graphics card
Complex PCBA designs can be simulated efficiently by sub-structuring, sub-modelling, and material homogenization. The animation ...
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Modelling of complex PCBAs
Building finite element models of PCBAs can be a challanging task. With our machine learning based homogenization method ...
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Thermal cycling of BGA solder joint sub-models
The structural zoom technique (also known as submodelling) can also be used to increase the accuracy of #FEA results in multiple ...
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Dynamic analysis of a PCBA in an enclosure
Since we use a general purpose open-source finite element solver as core of our simulation processes, we can combine PCBA ...
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