Thermal cycling of a BGA
- 06 / 07 / 2023
Ball grid array (#BGA) chips require special attention regarding solder joint reliability and the finite element analysis (#FEA) can be used to assess the reliability early in the design phase of an electronic component.
The animation shows the thermal cycling of an examplary BGA chip. The BGA model was built automatically, consisted of 172 differently shaped solder joints, and the Garofalo model was used to include the visco-plastic material behaviour in the model. The contour plot shows the equivalent visco-plastic strain in the solder.
Video: Visco-plastic thermo-mechanical analysis of an examplary BGA chip subjected to thermal cycling.
