Conjugate heat transfer analysis in an enclosure
We improved our conjugate heat transfer analysis process for PCBAs. We now can include SMDs in the models which are coupled ...
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Heat-up of a PCB
PCBAs have to withstand temperature changes and the resistance of a PCBA to extreme temperature changes is tested in thermal ...
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Cooldown of a PCB
PCBAs have to withstand temperature changes and the resistance of a PCBA to extreme temperature changes is tested in thermal ...
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Conjugate heat transfer analysis
We are currently working on a conjugate heat transfer analysis process for printed circuit board assemblies. The first step ...
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Thermo-mechanic sub-structures
Our solder-joint sub-structures now can represent the thermal-expansion of a solder-joint. This means that we can now build ...
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Structural Homogenization
Our homogenization process for generating homogenized material fields for structural material parameters is now also based ...
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Thermal Homogenization
We evaluated the efficiency and accuracy of our machine learning based material homogenization method for thermal analyses ...
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Thermal Analysis
We improved our thermal analysis capabilities by modelling solder-joints as thermal sub-structures and by modelling PCBs ...
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ODB++ support
We are now partner in the ODB++ design partnership program and support the ODB++ file format as an import format in our simulation ...
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