RMS strain

• 20 / 06 / 2023 

Flex cracking in MLCCs (Multilayer Ceramic Chip Capacitors) and cracking of solder joints can be caused by dynamic bending of a PCB, i.e., when a PCB is subjected to a random vibration load. With a frequency response analysis and Parseval's theorem we can calculate the RMS value of the maximum principal strains to predict critical areas on the PCB with respect to random vibration loads.