Thermal cycling of a BGA solder joint sub-model
- 09 / 07 / 2023
The structural zoom technique (also known as submodelling) can be used to increase the accuracy of #FEA results by increasing the number of elements in a small region of a finite element model and applying the displacements of a global model as boundary condition, e.g., for a single solder ball of a #BGA chip.
The animation shows the structural zoom technique applied to a single solder ball of the FE model from our last post. The Garofalo model was used to include the visco-plastic material behaviour in the model. The contour plot shows the equivalent visco-plastic strain in the solder.
Video: Visco-plastic thermo-mechanical analysis of a single solder ball subjected to thermal cycling.
