Sub-modelling of a BGA chip
- 07 / 09 / 2023
The structural zoom technique can also be applied on an entire ball grid array chip to increase the accuracy of #FEA results.
The animation shows the structural zoom technique applied to an entire ball grid array chip including more than 2000 solder joints. The Garofalo model was used to include the visco-plastic material behaviour in the solder. The contour plot shows the equivalent visco-plastic strain in the solder.
Video: Visco-plastic thermo-mechanical analysis of more than 2000 solder joints subjected to thermal cycling.
