Detailed sub-model of a BGA
- 28 / 09 / 2023
The structural zoom technique can also be applied on the results of another submodel, e.g., on the submodel used in our last post (an entire #BGA chip), to increase the accuracy of #FEA results.
The animation shows the structural zoom technique applied to a cutout of a BGA chip including solder joints, traces and vias. The Garofalo model was used to include the visco-plastic material behaviour in the solder. The contour plot shows the equivalent visco-plastic strain in the solder.
Video: Visco-plastic thermo-mechanical analysis applied to a cutout of a BGA chip.
