Thermal cycling of a graphics card

• 14 / 08 / 2023 

Complex PCBA designs can be simulated efficiently by sub-structuring, sub-modelling, and material homogenization.

The animation shows the thermal cycling (first cycle) of the IPC2581 test case 2 (a graphics card). The model consisted of approximately 14000 solder-joint sub-structures calculated from detailed solder-joint models. The contour plot in the solder joints shows the equivalent visco-plastic strain.