Thermal Analysis
- 26 / 01 / 2023
We improved our thermal analysis capabilities by modelling solder-joints as thermal sub-structures and by modelling PCBs by homogenized material fields. The thermal sub-structuring process is based on our structural sub-structuring algorithms and the thermal solder-joint sub-structures are automatically calculated from detailed solder-joint models. The homogenized material field is generated by a machine learning algorithm. The results of a thermal analysis can be used directly as load in a non-linear static analysis of PCBAs.
The animation shows a transient thermal analysis of a PCBA, in which seven SOICs on top of the PCBA are assumed to be heat sources that dissipate the power loss of the SMDs.
Video: Transient thermal analysis of a PCBA incorporating SMDs modeled by thermal solder-joint substructures and a PCB with a material field homogenized by machine learning
