Conjugate heat transfer analysis in an enclosure

• 04 / 05 / 2023 

We improved our conjugate heat transfer analysis process for PCBAs. We now can include SMDs in the models which are coupled with the PCB by thermal solder-joint sub-structures. The PCB is modeled by a homogenized material field. The thermal sub-structuring process is based on our structural sub-structuring algorithms and the thermal solder-joint sub-structures are automatically calculated from detailed solder-joint models. The homogenized material field is generated by a machine learning algorithm.

The animation shows a PCBA in a closed housing, in which some SOICs on both sides of the PCB are assumed to be heat sources that dissipate the power loss of the SMDs. The color represents the temperature on the PCBA and in the fluid.