Parametric modelling of QFNs
- 25 / 01 / 2024
Last year we made great progress in the development of automation routines and simulation processes for PCBAs. We will continue to further develop our automation routines and simulation processes in 2024.
We start with parametric FE models of QFN packages including detailed solder-joints of no-lead pins and the thermal pad.
Picture: Parametric modelling of QFN packages including no-lead solder-joints.
