Parametric hex-dominant finite element models of through hole devices
- 22 / 05 / 2025
In the project 'Modelling the reliability of through-hole-technology assemblies' funded by ESA we develop a simulation process for the thermo-mechanical analysis of THT solder joints based on open-source software. To this end, we develop parametric hex-dominant finite element models of through hole devices (THDs). The picture shows two exemplary THDs modelled in Salome and rendered in Paraview.
Picture: Finite element models of exemplary THDs.
