Modal sub-modelling (shock)

• 09 / 08 / 2024 

Performing a dynamic analysis of multiple printed circuit board assemblies (#PCBAs) including the geometric details of the #PCBs and the solder joints can be a challenging task, because of the computational effort. Thus, we developed a modal based sub-modelling simulation process, in which a single modal analysis is performed for an electronics component consisting of multiple coarse PCBs modeled by orthotropic material fields and #solder-joint #sub-structures calculated based on detailed solder-joint models. In the modal domain, then, global displacements are projected onto submodels. This modal basis can then be used to calculate the electronics components' response to a mechanical shock.

The video shows the animation of a shock response of multiple PCBAs mounted in an enclosure and for the submodel of an electrolytic capacitor including solder-joint stresses.