Dynamic Analysis Sweep

• 21 / 10 / 2022 

Our dynamic analysis process can be used to simulate the dynamic system response of an electronic component including PCBAs when subjected to deterministic, stochastic, or transient acceleration loads. In this video, we animated the dynamic system response of a PCBA to a logarithmic sweep load. The simulation was based on a modal analysis and the finite element model consisted of more than 3500 solder-joint substructures, which were calculated based on detailed models of the solder joints. In the animation, the rigid body motion was scaled down to the magnitude range of the relative displacements. The colormap was applied to the relative displacements of the PCB.